ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,409,983, issued on Sept. 9, was assigned to Dometic Sweden AB (Solna, Sweden). "Mobile cooling box with hinge module" was invented by Weixian ... Read More
ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,409,981, issued on Sept. 9, was assigned to SHENZHEN LIBRO TECHNOLOGY Co. LTD. (Shenzhen, China). "Food container and animal food dispensing d... Read More
ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,411,750, issued on Sept. 9, was assigned to INTERNATIONAL BUSINESS MACHINES Corp. (Armonk, N.Y.). "Cognitive bias detection and correction in ... Read More
ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,414,371, issued on Sept. 9, was assigned to Semiconductor Energy Laboratory Co. Ltd. (Atsugi, Japan). "Semiconductor device and manufacturing ... Read More
ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,410,017, issued on Sept. 9, was assigned to HITACHI LTD. (Tokyo). "Computer system, computer, and method for controlling conveyance system" wa... Read More
ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,411,468, issued on Sept. 9, was assigned to Rockwell Automation Technologies Inc. (Mayfield Heights, Ohio). "Data assessment and selection for... Read More
ALEXANDRIA, Va., Sept. 10 -- United States Patent no. D1,092,122, issued on Sept. 9. "Drop bread toaster" was invented by Eunseo Whaong (Fort Lee, N.J.). The patent was filed on Aug. 8, 2024, under ... Read More
ALEXANDRIA, Va., Sept. 10 -- United States Patent no. D1,092,538, issued on Sept. 9, was assigned to Saleise Health LLC (Bloomfield Hills, Mich.). "Display screen or portion thereof with graphical us... Read More
ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,414,061, issued on Sept. 9, was assigned to LG Electronics Inc. (Seoul, South Korea). "Method for transmitting and receiving signals in wirele... Read More
ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,800, issued on Sept. 9, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Integrated circuit package having enhanced thermal dissipation s... Read More